1. All products in the XPG™ v2.0 series include Thermal Conductive Technology, which aligns the surface of the memory chip to make direct contact with the heat sink, immediately dispersing heat away from the heat source.
2. All XPG™ v2.0 modules include 2OZ double-copper PCB to efficiently improve current transfer rates while lowering the system temperature and increasing system stability.
3. Blazing speed at DDR3 2200+, the transfer bandwidth can reach up to 17,600 MB/s (PC3 17600). With dual- or triple-channel design, the memory bandwidth can reach up to 51 GB/s.
4. All ADATA memory chips are stringently tested. However, actual performance may vary due to a computer’s motherboard, BIOS version, system configurations, operating system, system components, and other factors. Overclocking or changing the system clock may cause malfunction in some computer system components, and can even invalidate the computer’s warranty. Please read the computer user guide carefully or consult the manufacturer for more information.
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